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 FPF2000-FPF2007 IntelliMAXTM Advanced Load Management Products
December 2004
FPF2000-FPF2007
IntelliMAXTM Advanced Load Management Products
Features
1.8 to 5.5V Input Voltage Range Controlled Turn-On 50mA and 100mA Current Limit Options Under voltage Lockout Thermal Shutdown <1uA Shutdown Current Auto Restart Fast Current limit Response Time * 3us to Moderate Over Currents * 20ns to Hard Shorts Fault Blanking
General Description
The FPF2000 through FPF2007 is a family of load switches which provide full protection to systems and loads which may encounter large current conditions. These devices contain a 0.7 current-limited P-channel MOSFET which can operate over an input voltage range of 1.8-5.5V. Switch control is by a logic input (ON) capable of interfacing directly with low voltage control signals. Each part contains thermal shutdown protection which shuts off the switch to prevent damage to the part when a continuous over-current condition causes excessive heating. When the switch current reaches the current limit, the part operates in a constant-current mode to prohibit excessive currents from causing damage. For the FPF2000-FPF2002 and FPF2004FPF2006, if the constant current condition still persists after 10ms, these parts will shut off the switch and pull the fault signal pin (FLAGB) low. The FPF2000, FPF2001, FPF2004 and FPF2005, have an auto-restart feature which will turn the switch on again after 80ms if the ON pin is still active. The FPF2002 and FPF2006 do not have this auto-restart feature so the switch will remain off until the ON pin is cycled. For the FPF2003 and FPF2007, a current limit condition will immediately pull the fault signal pin low and the part will remain in the constant-current mode until the switch current falls below the current limit. For the FPF2000 through FPF2003, the minimum current limit is 50mA while that for the FPF2004 through FPF2007 is 100mA. These parts are available in a space-saving 5 pin SC-70 package.
Applications
PDAs Cell Phones GPS Devices MP3 Players Digital Cameras Peripheral Ports Hot Swap Supplies
Functional Block Diagram
VIN UVLO
ON
CONTROL LOGIC CURRENT LIMIT THERMAL SHUTDOWN
VOUT FLAGB
GND
(c)2004 Fairchild Semiconductor Corporation
1
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FPF2000-FPF2007 Rev. C1
FPF2000-FPF2007 IntelliMAXTM Advanced Load Management Products
Pin Configuration
VOUT 1 GND 2 FLAGB 3 SC70-5 4 ON 5 VIN
Pin Description
Pin
1 2 3 4 5
Name
VOUT GND FLAGB ON VIN Switch Output: Output of the power switch Ground
Function
Fault Output: Active LO, open drain output which indicates an over current, supply under voltage or over temperature state. On Control Input Supply Input: Input to the power switch and the supply voltage for the IC
Absolute Maximum Ratings
Parameter
VIN DC Input Voltage Power Dissipation for Single Operation @ 85C Operating Junction Temperature Storage Temperature Thermal Resistance, Junction to Ambient Electrostatic Discharge Protection HBM MM 4000 400 -40 -65
Min.
-0.3 -0.7
Max.
6 6 250 85 150 400
Units
V V mW C C C/W V V
Recommended Operating Range
Parameter
VIN Ambient Operating Temperature, TA
Min.
1.8 -40
Max.
5.5 85
Units
V C
2 FPF2000-FPF2007 Rev. C1
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FPF2000-FPF2007 IntelliMAXTM Advanced Load Management Products
Electrical Characteristics
VIN = 1.8 to 5.5V, TA = -40 to +85C unless otherwise noted. Typical values are at VIN = 3.3V and TA = 25C.
Parameter
Basic Operation Operating Voltage Quiescent Current
Symbol
VIN IQ ILATCH ISHDN RON VIH VIL
Conditions
Min.
1.8
Typ.
Max.
5.5
Units
V A
IOUT = 0mA
VIN = 1.8 to 3.3V VIN = 3.3 to 5.5V
60 100 40 1
Latch-Off Current Shutdown Current On-Resistance
FPF2002, FPF2006
A A V
TA = 25C, IOUT = 20mA TA = -40 to +85C, IOUT = 20mA VIN = 1.8V VIN = 5.5V VIN = 1.8V VIN = 5.5V VON = VIN or GND 0.5 0.9
0.7 0.85 0.66 1.22 0.64 1.17
1
ON Input Logic High Voltage
ON Input Logic Low Voltage
0.8 1.5 1 1
V
ON Input Leakage Off Switch Leakage FLAGB Output Logic Low Voltage ISWOFF
A A V
VON = 0V, VOUT = 0V VIN = 5V, ISINK = 10mA VIN = 1.8V, ISINK = 10mA VIN = 5V, Switch on 0.1 0.1
0.2 0.3 1
FLAGB Output High Leakage Current Protections Current Limit ILIM
A
VIN = 3.3V, VOUT = 0V VIN = 3.3V, VOUT = 0V
FPF2000, FPF2001, FPF2002, FPF2003 FPF2004, FPF2005, FPF2006, FPF2007
50 100
75 150 140 130
100 200
mA
Thermal Shutdown
TJ Increasing TJ Decreasing UVLO VIN Increasing 1.5
C C 1.7 V mV
Under Voltage Shutdown Under Voltage Shutdown Hysteresis Dynamic Turn on time Turn off time Rise Time Fall Time OVER Current Blanking Time Auto-Restart Time Short Circuit Response Time
1.6 50
tON tOFF tRISE tFALL tBLANK tRESTART
, CL=0.1F , CL=0.1F , CL=0.1F , CL=0.1F FPF2000, FPF2001, FPF2002, FPF2004, FPF2005, FPF2006 FPF2000, FPF2001, FPF2004, FPF2005 Vin = Von = 3.3V. Moderate Over-current condition. Vin = Von = 3.3V. Hard Shorts. 5 40
50 0.5 10 0.1 10 80 3 20 20 160
s s s s ms ms s nS
3 FPF2000-FPF2007 Rev. C1
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FPF2000-FPF2007 IntelliMAXTM Advanced Load Management Products
Typical Characteristics
75
90
VON = VIN
70
85 QUIESCENT CURRENT (A) 80 75 70 65 60 55 50 45
VON = VIN
QUIESCENT CURRENT (A)
65
VIN = 5.5V VIN = 3.3V
60
VIN = 1.8V
55
50 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 SUPPLY VOLTAGE (V)
40 -40 -15 10 35 60 85 TJ, JUNCTION TEMPERATURE (C)
Figure 1. Quiescent Current vs. Input Voltage
Figure 2. Quiescent Current vs. Temperature
160 140 OUTPUT CURRENT (mA) FPF2004, 2005, 2006, 2007 120 100 80 60 FPF2000,2001 2002, 2003 40 20 0 0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3 3.3 VIN - VOUT (V)
SHUTDOWN CURRENT (nA)
35 ISHDN 30 25 20 15 VIN = 5V 10 VIN = 3.3V 5 0 -40 -15 10 35 60 85 TJ, JUNCTION TEMPERATURE (C)
Figure 3. Current Limit vs. Output Voltage
Figure 4. Shutdown Supply Current vs. Temperature
180 160
1.1
ILIMIT
1 SWITCH RESISTANCE () 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0
-15 10 35 60 85
VIN = 1.8V
CURRENT LIMIT (mA)
140 120
FPF2004, 2005, 2006, 2007 VIN = 3.3V
VIN = 3.6V
100 80 60
VIN = 5V
FPF2000, 2001, 2002, 2003
40 20 0 -40
-40
-15
10
35
60
85
TJ, JUNCTION TEMPERATURE (C)
TJ, JUNCTION TEMPERATURE (C)
Figure 5. Current Limit vs. Temperature
Figure 6. Switch Resistance vs. Temperature
4 FPF2000-FPF2007 Rev. C1
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FPF2000-FPF2007 IntelliMAXTM Advanced Load Management Products
Typical Characteristics
52
35
VIN = 3.3V
LATCH-OFF CURRENT ( A) 48 44 40 36 32 28 -40 -15 10 35 60 85 TJ, JUNCTION TEMPERATURE (C)
SWITCH-OFF CURRENT (nA)
30 25 20 15 VIN = 5V 10 5 0 -40 VIN = 3.3V
-15
10
35
60
85
TJ, JUNCTION TEMPERATURE (C)
Figure 7. Latch-Off Current vs. Temperature
Figure 8. Switch-Off Current vs. Temperature
1.5 1.25
FPF2000, 2002, 2003, 2004, 2006, 2007
VIN
2V/Div
CIN = 10uF COUT = 1uF
ON THRESHOLD (V)
1
FPF2001, 2005
0.75 0.5 0.25 0 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 VIN VOLTAGE (V)
IOUT
2A/Div
VOUT
2V/Div
20uS/Div
Figure 9. ON Threshold vs. VIN
Figure 10. Short Circuit Response Time (Output to GND)
100
VDRV
2V/Div
RESTART TIME (mS) 80
VOUT
2V/Div
60
IOUT
50mA/ Div
40 -40 -15 10 35 60 85 TJ JUNCTION TEMPERATURE (C)
VFLAG
2V/Div 10mS/Div
Figure 11. Auto-Restart Time vs. Temperature
Figure 12. Auto-Restart Time Response
5 FPF2000-FPF2007 Rev. C1
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FPF2000-FPF2007 IntelliMAXTM Advanced Load Management Products
Typical Characteristics
100 TURN-RISE/FALL TIMES (S) 100
ILOAD = 10mA VCC = 3.3V TRise
TURN-ON/OFF TIMES (S)
ILOAD = 10mA VCC = 3.3V
TON
10
10
1
TFall
1
0.1
TOFF
0.1 -40 -15 10 35 60 85 TJ, JUNCTION TEMPERATURE (C)
0.01 -40 -15 10 35 60 85 TJ, JUNCTION TEMPERATURE (C)
Figure 13. Ton/Toff vs. Temperature
Figure 14. Trise/Tfall vs. Temperature
VON
2V / DIV
VON
2V / DIV
IOUT
10mA / DIV
IOUT
10mA / DIV
50uS/DIV
100nS/DIV
Figure 15. Turn-On Response
Figure 16. Turn-Off Response
12 FLAG-BLANKING TIME (mS)
VDRV
11
2V / DIV
VOUT
10
2V / DIV
9
IOUT
2V / DIV
8 -40 -15 10 35 60 85 TJ, JUNCTION TEMPERATURE (C)
VFLAG
2V / DIV 5mS/DIV
Figure 17. Blank Time vs. Temperature
Figure 18. Fault Blanking Response
6 FPF2000-FPF2007 Rev. C1
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FPF2000-FPF2007 IntelliMAXTM Advanced Load Management Products
Typical Characteristics
VIN
2V / DIV
CIN = 10uF COUT = 1uF
CIN = 1uF COUT = 1uF
VON
2V / DIV
VIN =VON
2V / DIV
IOUT
100mA / DIV
IOUT
100mA / DIV
VOUT
(Shorted to GND)
20uS/DIV
20uS/DIV
Figure 19. Current-Limit Response Time (Output to GND)
Figure 20. Current-Limit Response
Description of Operation
The FPF2000-FPF2007 are current limited switches that protect systems and loads which can be damaged or disrupted by the application of high currents. The core of each device is a 0.7 P-channel MOSFET and a controller capable of functioning over a wide input operating range of 1.8-5.5V. The controller protects against system malfunctions through current limiting, undervoltage lockout and thermal shutdown. The current limit is preset for either 50mA or 100mA. returns HI at the end of the fault condition. FLAGB is an opendrain MOSFET which requires a pull-up resistor between VIN and FLAGB. During shutdown, the pull-down on FLAGB is disabled to reduce current draw from the supply.
Current Limiting
The current limit ensures that the current through the switch doesn't exceed a maximum value while not limiting at less than a minimum value. For the FPF2000-FPF2003 the minimum current is 50mA and the maximum current is 100mA and for the FPF2004-FPF2007 the minimum current is 100mA and the maximum current is 200mA. The FPF2000-FPF2002 and the FPF2004-FPF2006, have a blanking time of 10ms, nominally, during which the switch will act as a constant current source. At the end of the blanking time, the switch will be turned-off and the FLAGB pin will activate to indicate that current limiting has occurred. The FPF2003 and FPF2007 have no current limit blanking period so immediately upon a current limit condition FLAGB is activated. These parts will remain in a constant current state until the ON pin is deactivated or the thermal shutdown turns-off the switch.
On/Off Control
The ON pin controls the state of the switch. Active HI and LO versions are available. Refer to the Ordering Information for details. Activating ON continuously holds the switch in the on state so long as there is no fault. For all versions, an under-voltage on VIN or a junction temperature in excess of 150C overrides the ON control to turn off the switch. In addition, excessive currents will cause the switch to turn off in FPF2000-FPF2002 and FPF2004-FPF2007. The FPF2000, FPF2001, FPF2004 and FPF2005 have an Auto-Restart feature which will automatically turn the switch on again after 80ms. For the FPF2002 and FPF2006, the ON pin must be toggled to turn-on the switch again. The FPF2003 and FPF2007 do not turn off in response to a over current condition but instead remain operating in a constant current mode so long as ON is active and the thermal shutdown or under-voltage lockout have not activated.
Under-Voltage Lockout
The under-voltage lockout turns-off the switch if the input voltage drops below the under-voltage lockout threshold. With the ON pin active the input voltage rising above the under-voltage lockout threshold will cause a controlled turn-on of the switch which limits current over-shoots.
Fault Reporting
Upon the detection of an over-current, an input under-voltage, or an over-temperature condition, the FLAGB signals the fault mode by activating LO. For the FPF2000-FPF2002 and FPF2004-FPF2006, the FLAGB goes LO at the end of the blanking time while FLAGB goes LO immediately for the FPF2003 and FPF2007. FLAGB remains LO through the AutoRestart Time for the FPF2000, FPF2001 FPF2004 and FPF2005. For the FPF2002 and FPF2006, FLAGB is latched LO and ON must be toggled to release it. With the FPF2003 and FPF2007, FLAGB is LO during the faults and immediately
Thermal Shutdown
The thermal shutdown protects the die from internally or externally generated excessive temperatures. During an over-temperature condition the FLAGB is activated and the switch is turned-off. The switch automatically turns-on again if temperature of the die drops below the threshold temperature.
7 FPF2000-FPF2007 Rev. C1
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FPF2000-FPF2007 IntelliMAXTM Advanced Load Management Products
Application Information
Typical Application
To Load
VOUT FPF2000-FPF2007
OFF ON
ON
GND
FLAGB
Input Capacitor
To limit the voltage drop on the input supply caused by transient in-rush currents when the switch turns-on into a discharged load capacitor or a short-circuit, a capacitor needs to be placed between VIN and GND. A 0.1F ceramic capacitor, CIN, placed close to the pins is usually sufficient. Higher values of CIN can be used to further reduce the voltage drop.
Over Current Blanking Time, tBLANK, so that the maximum power dissipated is,
t BLANK P ( max ) = -------------------------------------------------- x V IN ( max ) x I LIM ( max ) = t RESTART + t BLANK 10 = ------------------ x 5.5 x 0.2 = 1.22mW 80 + 10
(3)
Output Capacitor
A 0.1F capacitor COUT, should be placed between VOUT and GND. This capacitor will prevent parasitic board inductances from forcing VOUT below GND when the switch turns-off. For the FPF2000-FPF2002 and the FPF2004-FPF2006, the total output capacitance needs to be kept below a maximum value, COUT(max), to prevent the part from registering an over-current condition and turning-off the switch. The maximum output capacitance can be determined from the following formula,
I LIM ( max ) x t BLANK ( min ) C OUT = ------------------------------------------------------------------V IN
(1)
When using the FPF2002 and FPF2006 attention must be given to the manual resetting of the part. Continuously resetting the part at a high duty cycle when a short on the output is present can cause the temperature of the part to increase. The junction temperature will only be allowed to increase to the thermal shutdown threshold. Once this temperature has been reached, toggling ON will not turn-on the switch until the junction temperature drops. For the FPF2003 and FPF2007, a short on the output will cause the part to operate in a constant current state dissipating a worst case power as calculated in (3) until the thermal shutdown activates. It will then cycle in and out of thermal shutdown so long as the ON pin is active and the short is present.
Due to the integral body diode in the PMOS switch, a CIN greater than COUT is highly recommended. A COUT greater than CIN can cause VOUT to exceed VIN when the system supply is removed. This could result in current flow through the body diode from VOUT to VIN.
Board Layout
For best performance, all traces should be as short as possible. To be most effective, the input and output capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have on normal and short-circuit operation. Using wide traces for VIN, VOUT and GND will help minimize parasitic electrical effects along with minimizing the case to ambient thermal impedance.
Power Dissipation
During normal operation as a switch, the power dissipation is small and has little effect on the operating temperature of the part. The parts with the higher current limits will dissipate the most power and that will only be,
P = ( I LIM ) x R DS = ( 0.2 ) x 0.7 = 28mW
2
2
(2)
If the part goes into current limit the maximum power dissipation will occur when the output is shorted to ground. For the FPF2000, FPF2001, FPF2004 and FPF2005, the power dissipation will scale by the Auto-Restart Time, tRESTART, and the
8 FPF2000-FPF2007 Rev. C1
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Dimensional Outline and Pad Layout
SC70-5
SYMM C L 0.65 2.000.20
A
.5 min 5 4
B
1.9 1.250.10
1 (0.25) 0.65 1.30
3 0.30 0.15
0.10 M A B
0.4 min 1.30 LAND PATTERN RECOMMENDATION
1.00 0.80 1.10 0.80
0.10 C C
SEE DETAIL A
0.10 0.00 Seating Plane
(0.43) 2.100.10
GAGE PLANE R0.10 0.25 0.10 0.20
0.45 0.30 DETAIL A
0-30
NOTES: A. THIS PACKAGE CONFORMS TO EIAJ SC-88A, 1996. B. DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS DO NOT INCLUDE BURRS OR MOLD FLASH.
Ordering Information
Minimum Current Limit [mA]
50 50 50 50 100 100 100 100
Part Number
FPF2000 FPF2001 FPF2002 FPF2003 FPF2004 FPF2005 FPF2006 FPF2007
Current Limit Blanking Time [ms]
10 10 10 0 10 10 10 0
Auto-Restart Time [ms]
80 80 NA NA 80 80 NA NA
ON Pin Activity
Active HI Active LO Active HI Active HI Active HI Active LO Active HI Active HI
Top Mark
200 201 202 203 204 205 206 207
9 FPF2000-FPF2007 Rev. C1
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TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.
ACExTM FAST ActiveArrayTM FASTrTM BottomlessTM FPSTM CoolFETTM FRFETTM CROSSVOLTTM GlobalOptoisolatorTM DOMETM GTOTM EcoSPARKTM HiSeCTM E2CMOSTM I2CTM EnSignaTM i-LoTM FACTTM ImpliedDisconnectTM FACT Quiet SeriesTM
IntelliMAXTM ISOPLANARTM LittleFETTM MICROCOUPLERTM MicroFETTM MicroPakTM MICROWIRETM MSXTM MSXProTM OCXTM OCXProTM Across the board. Around the world.TM OPTOLOGIC OPTOPLANARTM The Power Franchise PACMANTM Programmable Active DroopTM
POPTM Power247TM PowerEdgeTM PowerSaverTM PowerTrench QFET QSTM QT OptoelectronicsTM Quiet SeriesTM RapidConfigureTM RapidConnectTM SerDesTM SILENT SWITCHER SMART STARTTM
SPMTM StealthTM SuperFETTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TinyLogic TINYOPTOTM TruTranslationTM UHCTM UltraFET UniFETTM VCXTM
DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component is any component of a life 1. Life support devices or systems are devices or support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.
Preliminary
First Production
No Identification Needed
Full Production
Obsolete
Not In Production
This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Rev. I15
10 FPF2000-FPF2007 Rev. C1
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